Specifications: Dell™ OptiPlex™ GX1
Systems
|
| General | System Information | Expansion Bus
| System Clocks | Memory | Drives | Ports | Audio | Video | Supported Resolutions | Power | Physical | Environmental
| Regulatory Notices |
|
| Microprocessor types |
Intel� Pentium� II
microprocessor with MMX™ technology or Intel Pentium III microprocessor |
| Microprocessor speeds |
266, 333, 350, 400, or 450 MHz
(Pentium II);
450, 500, 550, or 600 MHz (Pentium III) |
| Internal cache |
KB (16-KB data cache, 16-KB
instruction cache) |
| L2 cache memory |
512-KB pipeline burst, 4-way
set-associative, write-back SRAM |
| Math coprocessor |
internal to the microprocessor |
| Microprocessor slot |
slot 1 |
|
| System chip set |
Intel 440BX PIIX4e |
| Data bus width |
64 bits |
| Address bus width |
32 bits |
| DMA channels |
seven |
| Timers |
three |
| Interrupt levels |
15 |
| Flash EPROM (BIOS) |
2 Mb |
| BIOS source |
Dell |
| NIC controller chip |
optional integrated 3Com� PCI 3C905B-TX
Wakeup On LAN NIC, operating at 10 or 100 Mbps |
| I/O controller chip |
National PC87309 |
|
| Bus type |
PCI (2.1-compliant) and ISA |
| Expansion-card slots: |
|
Small-form-factor chassis
|
two PCI expansion slots
(half-length PCI expansion cards only) |
Low-profile chassis
|
(uses passive riser
configuration only) three total: one dedicated PCI slot, one dedicated ISA slot, and one
PCI/ISA slot |
Midsize chassis
|
(passive riser configuration)
five total: two dedicated PCI slots, two ISA slots, and one PCI/ISA slot
or
(active riser configuration) five total: three dedicated PCI slots and two PCI/ISA slots |
Mini tower chassis
|
(uses active riser configuration
only) seven total: three dedicated PCI slots, two dedicated ISA slots, and two PCI/ISA
slots |
| Bus speeds |
PCI: 33 MHz
ISA: 8.33 MHz |
| PCI data transfer rate |
132 MB per second (burst reads and writes) |
| Plug and Play revision |
1.0A |
| PCI bus specification |
complies with PCI specification 2.1 |
| PCI-to-PCI bridging |
supported |
| ISA connector data width |
16 bits |
| PCI connector data width |
32 bits (maximum) |
| ISA expansion-card connector size |
98 pins |
|
| Diskette/communications ports |
48 MHz from system clock |
| System clock |
66/100 MHz |
| Keyboard controller |
48 MHz |
|
| Architecture |
64-bit (non-ECC) or 72-bit
(ECC), noninterleaved |
| Wait states |
near zero |
| DIMM sockets |
three (gold contacts) |
| DIMM capacities |
32-, 64-, and 128-MB non-ECC
SDRAM ("PC100" 100 MHz);
32-, 64-, 128-, and 256-MB ECC SDRAM ("PC100" 100 MHz) |
| Minimum RAM |
32 MB |
| Maximum RAM |
768 MB |
| Memory access time |
synchronized with system clock |
| BIOS address |
F0000h |
|
| Externally accessible bays: |
|
Small-form-factor chassis
|
one 3.5-inch bay for a 3.5-inch
diskette drive; one 5.25-inch bay for a removable media device (slim-height devices only) |
Low-profile chassis
|
one 5.25-inch bay for diskette,
tape, or CD-ROM drive; one 3.5-inch bay for a diskette drive |
Midsize chassis
|
two 5.25-inch bays for diskette,
tape, or CD-ROM drives; one 3.5-inch bay for a diskette drive |
Mini tower chassis
|
three 5.25-inch bays for
diskette, tape, or CD-ROM drives; one 3.5-inch bay for a diskette drive |
| Internally accessible bays: |
|
Small-form-factor chassis
|
one 3.5-inch bay for a 1-inch-high enhanced integrated drive
electronics (EIDE) hard-disk drive |
Low-profile chassis
|
one 3.5-inch bay for a
1-inch-high hard-disk drive |
Midsize chassis
|
two 3.5-inch bays: one for a
1-inch-high hard-disk drive and one for a 1.6-inch-high hard-disk drive |
Mini tower chassis
|
two 3.5-inch bays: one for a
1-inch-high hard-disk drive and one for a 1.6-inch-high hard-disk drive |
|
| Externally accessible: |
|
Serial (DTE)
|
two 9-pin connectors
(16550-compatible) |
Parallel
|
25-hole connector
(bidirectional) |
Video
|
15-hole connector |
NIC
|
RJ45 connector |
PS/2-style keyboard
|
6-pin mini-DIN |
PS/2-compatible mouse
|
6-pin mini-DIN |
USB
|
two USB-compliant connectors |
Audio line-in
|
miniature audio jack |
Audio line-out
(amplified source)
|
miniature audio jack |
Microphone
|
miniature audio jack |
| Internally accessible: |
|
Primary EIDE hard-disk drive
|
40-pin connector on PCI local
bus |
Secondary EIDE hard-disk drive
|
40-pin connector on PCI local
bus |
Diskette drive
|
34-pin connector |
ATI multimedia
|
40-pin connector |
ATAPI
|
4-pin connector |
|
| Model |
Crystal Semiconductor |
| Chip set |
CS4236 |
| Jacks: |
|
Audio line-in
|
one miniature audio jack |
Audio line-out
|
one miniature audio jack
(amplified) |
Microphone
|
one miniature audio jack |
|
| Video type |
integrated ATI Rage Pro (AGP 2X)
graphics |
| Video memory |
4 MB standard (upgradable to 8
MB) SGRAM |
|
| Video Resolution |
Maximum Color Depth |
Maximum Refresh Rate |
Minimum SGRAM Required |
| 640 x 480 |
True-color (32 bpp) |
85 Hz |
4 MB |
| 800 x 600 |
True-color (32 bpp) |
85 Hz |
4 MB |
| 1024 x 768 |
True-color (32 bpp) |
85 Hz |
4 MB |
| 1280 x 1024 |
True-color (32 bpp) |
85 Hz |
8 MB |
| 1600 x 1200 |
65,535 colors (16 bpp) |
75 Hz |
8 MB |
|
|
| DC power supply: |
|
Wattage
|
small-form-factor chassis: 110
W;
low-profile chassis: 145 W;
midsize chassis: 200 W;
mini tower chassis: 200 W |
Voltage
|
90 to 135 V at 60 Hz;
180 to 265 V at 50 Hz |
Heat dissipation
|
small-form-factor chassis: 808
BTU/hr (nominal);
low-profile chassis: 808 BTU/hr (nominal);
midsize chassis: 913 BTU/hr (nominal);
mini tower chassis: 913 BTU/hr (nominal) |
Backup battery
|
3-V CR2032 coin cell |
|
| Small-form-factor chassis: |
|
Weight
|
6.6 kg (14.5 lb) |
Height
|
9.1 cm (3.6 inches) |
Width
|
31.8 cm (12.5 inches) |
Depth
|
37.8 cm (14.9 inches) |
| Low-profile chassis: |
|
Weight
|
10.89 kg (24 lb) |
Height
|
10.9 cm (4.3 inches) |
Width
|
40.89 cm (16.1 inches) |
Depth
|
43.69 cm (17.2 inches) |
| Midsize chassis: |
|
Weight
|
12.7 kg (28 lb) |
Height
|
16.5 cm (6.5 inches) |
Width
|
41.9 cm (16.5 inches) |
Depth
|
44.5 cm (17.5 inches) |
| Mini tower chassis: |
|
Weight
|
14.3 kg (33.0 lb) or more,
depending on options installed |
Height
|
44.4 cm (17.5 inches) |
Width
|
20.6 cm (8.1 inches) |
Depth
|
43.7 cm (17.2 inches) |
|
| Temperature: |
|
Operating
|
10� to 35�C (50� to 95�F) |
Storage
|
–40� to 65�C (–40�
to 149�F) |
| Relative humidity |
20% to 80% (noncondensing) |
| Maximum vibration: |
|
Operating
|
0.25 G at 3 to 200 Hz at 1
octave/min |
Storage
|
0.5 G at 3 to 200 Hz at 1
octave/min |
| Maximum shock: |
|
Operating
|
left side (for mini tower
orientation) and bottom (for low-profile and midsize orientation) half-sine pulse with a
change in velocity of 20 inches/sec (50.8 cm/sec) |
Storage
|
27-G faired square wave with a
velocity change of 200 inches/sec (508 cm/sec) |
| Altitude: |
|
Operating
|
–16 to 3048 m* (–50 to
10,000 ft) |
Storage
|
–16 to 10,600 m (–50
to 35,000 ft) |
| * The maximum operating temperature of 35�C
(95�F) is for altitudes below 914.6 m (3000 ft). Above 914.6 m the maximum operating
temperature is reduced. |
|
|
|
|
| FCC (U.S. only) |
Class B (small-form-factor,
low-profile, and midsize chassis)
Class A1, Class B2 (mini tower chassis) |
| IC Notice (Canada only) |
Class B |
| CE Notice |
Class B |
| DMI 3.0-compliant |
|
| APM 1.1-compliant |
|
| FCC ID |
Class B |
| EN 55022 (Czech Republic only) |
Category B |
| VCCI Notice (Japan only) |
Class 1, Class 2 |
| Korean Regulatory Notice |
Class A, Class B |
| NOM 024 Information (Mexico
only) |
|
| Polish Center for Testing and
Certification |
|
1 For the mini tower chassis when networked
2 For the mini tower chassis when in stand-alone mode |
