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Specifications: Dell OptiPlex GX200 System User's Guide

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Specifications: Dell™ OptiPlex™ GX200 System User's Guide

bullet.gif (1107 bytes) Processor Ports
Memory Key Combinations
System Information Controls and Indicators
Video Power
Audio Physical
Expansion Bus Environmental
Drives

Processor

Microprocessor type Intel® Pentium® III microprocessor. Design provides for future Dell-supported upgrades. A slower compatibility speed can be set through System Setup.
Internal cache 32-kilobyte (KB) first-level (16-KB data cache; 16-KB instruction cache)
Level 2 (L2) cache memory 256-KB advanced transfer cache (full speed)
Math coprocessor internal to Pentium III microprocessor

Memory

Architecture error-checking and correction (ECC) or non-ECC Rambus dynamic RAM (DRAM)
Rambus in-line memory module (RIMM) sockets two, with a maximum of 32 devices
RIMM capacities 64-, 128-, 256-, and 512-MB Rambus DRAM (RDRAM)
Standard RAM 64 MB minimum
Maximum RAM 1-GB (availability of 1-GB systems depends on market availability of 512-MB RIMMs)
BIOS address F0000h

System Information

System chip set Intel 82820 Peripheral Component Interconnect/accelerated graphics port (PCI/AGP)
Data bus width 64 bits
Address bus width 32 bits
Direct memory access (DMA) channels eight
Interrupt levels 15
System basic input/output system (BIOS) chip 4 megabits (Mb)
System clock Host—100 or 133 MHz (matches external bus speed)
AGP—66 MHz
Memory—300/400 MHz
Network interface controller 3Com 3C920

Video

Video type integrated NVIDIA TNT2 4X AGP
Video memory 8 MB standard, upgradable to 16 MB

Audio

Audio type SoundBlaster emulation
Audio controller Analog Devices AD1881 AC97 Codec
Stereo conversion 16 bit (analog-to-digital and digital-to-analog)
Interfaces:

Internal

PCI bus/AC97

External

stereo line-in minijack;
microphone-in minijack;
headphones/speakers-out minijack

Expansion Bus

Bus types PCI, Industry-Standard Architecture (ISA), and AGP
Bus speed ISA: 8.33 MHz
PCI: 33 MHz
AGP: 66 MHz
Small form-factor chassis
expansion-card connectors:

PCI riser board

two PCI expansion slots
Low-profile chassis
expansion-card connectors:

PCI riser board (standard)

three PCI expansion slots

PCI/ISA riser board (optional)

one PCI expansion slot; one ISA expansion slot; one shared PCI/ISA expansion slot
Midsize chassis
expansion-card connectors:

PCI riser board (standard)

five PCI expansion slots

PCI/ISA riser board (optional)

two PCI expansion slots; two ISA expansion slots; one shared PCI/ISA expansion slot
Mini tower chassis
expansion-card connectors:

PCI riser board (standard)

five PCI expansion slots

PCI/ISA riser board (optional)

three PCI expansion slots; two ISA expansion slots; two shared PCI/ISA expansion slots
PCI expansion-card connector size 120 pins
PCI expansion-card connector data width (maximum) 32 bits
ISA expansion-card connector size 98 pins
ISA expansion-card connector data width (maximum) 16 bits

Drives

Externally accessible bays:

Small form-factor systems

one 3.5-inch bay for a 3.5-inch diskette drive; one 5.25-inch bay for a removable media device

Low-profile systems

one 3.5-inch bay for a 3.5-inch diskette drive; one 5.25-inch bay for a removable media device

Midsize  systems

one 3.5-inch bay for a 3.5-inch diskette drive; two 5.25-inch bays for removable media devices

Mini tower systems

one 3.5-inch bay for a 3.5-inch diskette drive; three 5.25-inch bays for removable media devices
Internally accessible bays:

Small form-factor systems

one bay for a 1-inch-high enhanced integrated drive electronics (EIDE) hard-disk drive

Low-profile systems

one bay for a 1-inch-high enhanced integrated drive electronics (EIDE) hard-disk drive

Midsize  systems

two 3.5-inch bays for either one or two 1-inch-high hard-disk drives, or one 1-inch-high hard-disk drive and one 1.6-inch-high hard-disk drive

Mini tower systems

two 3.5-inch bays for either one or two 1-inch-high hard-disk drives, or one 1-inch-high hard-disk drive and one 1.6-inch-high hard-disk drive

Ports

Externally accessible:

Serial Data Terminal Equipment (DTE)

two 9-pin connectors; 16550-compatible

Parallel

one 25-hole connector (bidirectional)

Video

one 15-hole connector

Integrated network interface controller (NIC)

RJ45 connector

PS/2-style keyboard

6-pin miniature DIN

PS/2-compatible mouse

6-pin mini-DIN

USB

two USB-compliant connectors

Audio

one microphone-in jack;
one line-in/audio-in jack;
one headphones/speakers jack
Internally accessible:

Primary EIDE hard-disk drive

40-pin connector on PCI local bus

Secondary EIDE hard-disk drive

40-pin connector on PCI local bus

Diskette drive

34-pin connector

CD-ROM drive audio interface

4-pin connector

Wakeup On LAN

3-pin connector

Fan

3-pin connector

Speaker

4-pin connector

Telephony

4-pin connector

Key Combinations

<Ctrl><Alt><Del> restarts (reboots) the system
<F2> starts System Setup (during POST only)
<Ctrl><Alt><\> toggles microprocessor speeds on 101-key keyboard (in MS-DOS® real mode only)
<Ctrl><Alt><#> toggles microprocessor speeds on 102-key keyboard (in MS-DOS real mode only)
<Ctrl><Enter> disables the system password at start-up

Controls and Indicators

Reset control (low profile, midsize, and mini tower chassis only) push button
Power control push button
Power indicators green LEDs (one on front panel, one on riser board); blinking green in sleep state
Hard-disk drive access indicator green LED
Link integrity and speed indicator (on integrated NIC connector) orange or green LED
Activity indicator (on integrated NIC connector) yellow LED

Power

DC power supply:

Wattage

small form-factor chassis: 110 W;
low-profile chassis: 145 W;
midsize chassis: 200 W;
mini tower chassis: 200 W

Heat dissipation

small form-factor chassis: 808 BTU/hr (nominal);
low-profile chassis: 808 BTU/hr (nominal);
midsize chassis: 913 BTU/hr (nominal);
mini tower chassis: 913 BTU/hr (nominal)

Voltage

90 to 135 V at 60 Hz; 180 to 265 V at 50 Hz
Backup battery 3-V CR2032 coin cell

Physical

Small form-factor chassis:

Height

9.14 cm (3.6 inches)

Width

31.75 cm (12.5 inches)

Depth

37.8 cm (14.9inches)

Weight

7.7 kg (17 lb)
Low-profile chassis:

Height

10.9 cm (4.3 inches)

Width

40.9 cm (16.1 inches)

Depth

43.7 cm (17.2 inches)

Weight

10.9 kg (24 lb)
Midsize chassis:

Height

16.5 cm (6.5 inches)

Width

41.9 cm (16.5 inches)

Depth

44.5 cm (17.5 inches)

Weight

12.7 kg (28 lb)
Mini tower chassis:

Height

44.4 cm (17.5 inches)

Width

20.6 cm (8.1 inches)

Depth

43.7 cm (17.2 inches)

Weight

14.9 kg (33.0 lb) or more, depending on options installed

Environmental

Temperature:

Operating

0° to 40°C (50° to 104°F)

Storage

–40° to 65°C (–40° to 149°F)
Relative humidity 20% to 80% (noncondensing)
Maximum vibration:

Operating

0.25 G at 3 to 200 Hz at 1 octave/min

Storage

0.5 G at 3 to 200 Hz at 1 octave/min
Maximum shock:

Operating

bottom half-sine pulse with a change in velocity of 50.8 cm/sec (20 inches/sec)

Storage

27-G faired square wave with a velocity change of 508 cm/sec (200 inches/sec)
Altitude:

Operating

–16 to 3048 m (–50 to 10,000 ft)

Storage

–16 to 10,600 m (–50 to 35,000 ft)

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